Multilayer Ceramic Substrates
Multilayer Ceramic Substrates
- MARUWA
- 3.30 g/㎤, 350 MPa
1. Bulk density: 3.30 g/㎤
2. Bending strength: >350 MPa
Features
Due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures, e.g. cavity structures, are available.
AlN, an excellent heat disspation material, has been proven to efficiently release the heat from high heat generating IC chips.
Structure sample (cross-section)
Substrate characteristic
Item 単位 AlN Color - Gray Bulk density g/㎤ 3.30 Mechanical characteristics Bending strength MPa >350 Thermal characteristics Coefficient of thermal expansion ppm/℃ 4.6 Thermal conductivity W/(m･K) 170 Electrical characteristics Dielectric constant 1GHz - 8.8 Volume resistivity 100Vdc Ω･㎝ >1014 Breakdown strength ㎸/100㎛ 20
